Principal Packaging Engineer

General Description

My client is looking for a Principal Semiconductor Packaging Engineer to lead the development of next-generation 2.5D and 3D packaging technologies.

Please read the information in this job post thoroughly to understand exactly what is expected of potential candidates.

What you’ll do:

• Architect innovative 2.5D/3D packaging solutions from concept to prototype.
• Lead advanced packaging R&D programmes and technology roadmaps.
• Oversee design, assembly, test, and validation of complex semiconductor packages.
• Collaborate across teams to solve system-level packaging challenges.
• Represent the company in technical discussions, bids, and industry forums.

What we’re looking for:

• Strong experience in semiconductor package design and development (3D/2.5D)
• Proven track record leading microelectronics packaging projects.
• Deep understanding of design, modelling, and validation processes.
• Excellent communication, leadership, and problem-solving skills. xwzovoh

Benefits:

• Competitive salary
• 15% pension (10% employer)
• Annual bonus
• Private medical cover extended to family
• Sponsorship with up to £5000 in relocation fees

If you’re looking for a strategic, hands-on role aims to define and deliver next-generation packaging for AI applications, contact Ella Flynn at IC Resources.